8-inch wafer solder bump printer "MT-80SP"
Test printing is possible! Printing on polyimide coverings and more can be done with high precision and fully automatically.
The "MT-80SP" is a fully automatic screen printing machine for wafers, designed for cassette-to-cassette operation and compatible with various wafer sizes. The loader section is equipped with cassettes (compatible with various standards). A horizontal transport robot arm automatically retrieves the wafers, performs pre-alignment (notch detection), carries out the printing process, and then stores them back in the cassette. It can print solder bumps and polyimide coverings with high precision and fully automatically. An FFU installation is also available as an option. 【Features】 ■ Test printing available ■ Compatible with various wafer sizes ■ Loader section equipped with cassettes (compatible with various standards) ■ High precision and fully automatic printing ■ FFU installation available as an option * Test printing is available! Please feel free to contact us. * For more details, please refer to the PDF materials or feel free to contact us.
- Company：マイクロ・テック
- Price：Other
